Ullrich Pfeiffer received the Ph.D. in physics from the University of Heidelberg, Germany, in 1999. Till 2006 he was with the IBM T.J. Watson Research Center where his research involved RF circuit design and packaging for 60GHz communication. Since 2008 he holds the High-frequency and Communication Technology chair at the University of Wuppertal, Germany. His current research activities include the design of silicon integrated circuits for THz applications. Among other awards, he is the recipient of the
2007 European Young Investigator Award, the co-recipient of the 2004 and 2006 Lewis Winner Award, as well as the 2012 and 2018 Jan Van Vessem Award at the ISSCC Conference. In 2017 he received the Microwave Prize. He is an IEEE Fellow, served as an IEEE SSCS Distinguished lecturer, has authored and co- authored 200+ publications, and has been the co-inventor of 10+ US and international issued patents, relating to RF, millimeter-wave, terahertz communication/imaging circuits and sensors.
Towards Terahertz/6G Systems-on-a-Chip
In order to address the need of future THz networks in excess of Tbit/s, it is inevitable, that today’s terahertz integrated circuits need to evolve to handle high carrier frequencies with ten’s of GHz RF bandwidth and MIMO network architecture simultaneously. The talk will present the capabilities of silicon process technologies, first wireless MIMO chip-sets with data-rates in excess of 100Gbit/s, and examples for wireless terahertz imaging and sensing applications. First attempts towards terahertz Systems-on-a-Chip (SoC) containing digital, analog, mixed-signal, and terahertz signal processing functions are presented.